Wangling F4BM217 DK2.17 PTFE Laminates 0.1mm - 12.0mm RF Microwave PCB Material
Brief Introduction
F4BM217 is a PTFE-based, fiberglass-reinforced laminate designed for high-frequency printed circuit board applications. With a dielectric constant of 2.17 and low loss characteristics, it is suitable for RF and microwave designs where signal integrity and lightweight construction are critical.
Technical Features & Benefits
Low Dielectric Constant: Dk = 2.17 ±0.04 at 10 GHz, ensuring stable signal propagation.
Low Dissipation Factor: Loss tangent as low as 0.001 at 10 GHz, minimizing signal loss.
Good Thermal Stability: CTE in XY direction: 25-34 ppm/°C, Z direction: 240 ppm/°C.
High Electrical Insulation: Volume resistivity ≥6×106 MΩ·cm, surface resistivity ≥1×106 MΩ.
Lead-Free Process Compatible: Suitable for modern PCB manufacturing processes.
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Typical Properties: F4BM 217
| Property |
Test Condition |
Unit |
F4BM217 |
| Dielectric Constant (Typ.) | 10 GHz | - | 2.17 |
| Dk Tolerance | - | - | ±0.04 |
| Loss Tangent (Typ.) | 10 GHz | - | 0.001 |
| 20 GHz | - | 0.0014 |
| TC of Dk | -55°C to 150°C | ppm/°C | -150 |
| Peel Strength (1 oz) | ED Copper | N/mm | >1.8 |
| Volume Resistivity | Ambient | MΩ·cm | ≥6×106 |
| Surface Resistivity | Ambient | MΩ | ≥1×106 |
| Dielectric Strength (Z) | 5 kV, 500 V/s | kV/mm | >23 |
| Breakdown Voltage (XY) | 5 kV, 500 V/s | kV | >30 |
| CTE (XY) | -55°C to 288°C | ppm/°C | 25-34 |
| CTE (Z) | -55°C to 288°C | ppm/°C | 240 |
| Water Absorption | 20±2°C, 24 h | % | ≤0.08 |
| Density | Ambient | g/cm³ | 2.17 |
| Thermal Conductivity (Z) | Z-direction | W/(m·K) | 0.24 |
| Flammability | - | UL 94 | V-0 |
Application Areas
Microwave and RF circuits
Radar and communication systems
Aerospace electronics
High-frequency test fixtures
Low-loss antenna substrates
Available Configurations
Copper Foil: ED copper, 0.5–2 oz options
Panel Sizes: 460×610 mm, 500×600 mm, 850×1200 mm, etc.
Thickness Range: 0.1 mm to 12.0 mm
Metal-Clad Options: Aluminum or copper-backed versions available (F4BM217–AL/CU)
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