Wangling F4BM217 DK2.17 PTFE Laminates 0.1mm - 12.0mm RF Microwave PCB Material

Brief Introduction

F4BM217 is a PTFE-based, fiberglass-reinforced laminate designed for high-frequency printed circuit board applications. With a dielectric constant of 2.17 and low loss characteristics, it is suitable for RF and microwave designs where signal integrity and lightweight construction are critical.

Technical Features & Benefits

• Low Dielectric Constant: Dk = 2.17 ±0.04 at 10 GHz, ensuring stable signal propagation.
• Low Dissipation Factor: Loss tangent as low as 0.001 at 10 GHz, minimizing signal loss.
• Good Thermal Stability: CTE in XY direction: 25-34 ppm/°C, Z direction: 240 ppm/°C.
• High Electrical Insulation: Volume resistivity ≥6×10⁶ MΩ·cm, surface resistivity ≥1×10⁶ MΩ.
• Lead-Free Process Compatible: Suitable for modern PCB manufacturing processes.

Typical Properties: F4BM 217

Application Areas

• Microwave and RF circuits
• Radar and communication systems
• Aerospace electronics
• High-frequency test fixtures
• Low-loss antenna substrates

Available Configurations

• Copper Foil: ED copper, 0.5–2 oz options
• Panel Sizes: 460×610 mm, 500×600 mm, 850×1200 mm, etc.
• Thickness Range: 0.1 mm to 12.0 mm
• Metal-Clad Options: Aluminum or copper-backed versions available (F4BM217–AL/CU)